DDR4 SODIMM
InnoDisk
DDR4 SODIMM is the compact memory module that brings the fastest speed in the industry at 3200MT/s.
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DDR4 SODIMM is the compact memory module that brings the fastest speed in the industry at 3200MT/s.
DDR4 UDIMM offers the industry's fastest memory speed with 3200MT/s - the perfect fit for any surveillance, automation and embedded application.
DDR4 UDIMM VLP offers a very low-profile design and the industry's fastest memory speed with 2666MT/s, and it is fully compatible with the Intel® Purely platform and 1U devices.
DDR4 WT (wide temperature) RDIMM offers the industry's fastest memory speed with 2666MT/s, and it is fully compatible with the Intel® Purely platform.
The Robust Memory series DDR4 WT SODIMM is DRAM made for though environments with extreme temperatures or rapid thermal cycling! These hardy modules are perfect for in-vehicle, outdoor kiosks, and aerospace & defense applications. All modules surpass the JEDEC standard and are certified for operation in temperatures ranging from -40° to 85° C.
The Robust Memory series DDR4 WT UDIMM is DRAM made for though environments with extreme temperatures or rapid thermal cycling! These hardy modules are perfect for in-vehicle, outdoor kiosks, and aerospace & defense applications. All modules surpass the JEDEC standard and are certified for operation in temperatures ranging from -40° to 85° C.
Intel® Atom™ x5-E3930 1.3GHz (up to 1.8 GHz) Solution
DIN Rail mounted PC Core i5-8365UE / Celeron 4205U CPU Triple GbE LAN Ports Multiple USB 3.2 Gen 2 (10Gb/s) Multiple COM Ports Modularized Flexible Expansion
Fanless DIN-Rail Embedded System with Tiger Lake 11 th Gen Intel® Core™ Solution (up to 4 cores)
Fanless DIN-Rail Embedded System with Marvell® ARMADA® 88F7040 Solution
Fanless DIN-Rail Embedded System Elkhart Lake Intel® Celeron™ Solution (up to 4 cores)
Fanless DIN-Rail Embedded System Jasper Lake Intel® Celeron™ Solution (up to 4 cores)
Fanless DIN-Rail Embedded System Tiger Lake 11 th Gen Intel® Celeron™ Solution (up to 4 cores)
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Rugged Chassis for Mobile Military Applications. Designed for Harsh Mechanical, Climatic, Chemical and Electrical Stresses.
Rugged Chassis for Mobile Military/Aerospace Applications. Designed for Harsh Mechanical, Climatic, Chemical and Electrical Stresses.
Rugged Chassis for Mobile Military/Aerospace Applications. Designed for Harsh Mechanical, Climatic, Chemical and Electrical Stresses.
Rugged Chassis for Mobile Military/Aerospace Applications. Designed for Harsh Mechanical, Climatic, Chemical and Electrical Stresses.